1.Flexible Workholder and Input /Output Modules
2.Stand-alone or In-line Configuration
3.Able to pick Die from Wafer or Waffle Tray (A-8020 Model)
4.Wafer Map Input Capability
5.User Friendly Operation Under Windows Environment
6.Programmable Bonding Parameters and Substrate Handler
7.Missing Die Detector
8.High Performance and Accuracy Pattern Recognition System
9.High Output for Quick Return of Investment
US-2900B Automatic Rotary Head Wedge Wire Bonder
1.Provide bonding clearance for high SMT components up to 6 mm
2.Large travel range for XY table (200 x 150 mm)
3.Intelligent loop control
4.Mutli-die/Multi-unit programming capability
5.Automatic handler for PCB or carriers
AD-33 Automatic Fluid Dispensing System
1.For dam & fill or multi-needle synchronized dispensing
2.Precision dispense valve with anti-dripping feature
3.Independent temperature controls for pre-heat,
4.Dispense and post-heat all three stages
5.SMEMA in-line capability
6.Automatic needle calibration
7.Automatic height censoring
IS-33 Third Optical Inspection System
1.Fully Automatic Universal Handler
2.Programmable XY Table
3.Powerful Operating System and Data Collection Software under User Graphical Interface
4.Flexible Inspection Mode for Production and Quality Management
5.Hard Disk & Floppy Disk Storage and PC Network Compatibility
6.Ergonomically Designed for Operator Comfort and Convenience
7.Automatic Reject/Reword Identification using Lead Puncher, Bottom Scriber, Wire Breaker and Ink Marker