产品与服务
AMTEK HCC ELECTRONIC PACKAGING
| HCC Electronic Packaging |
| Hermetic microelectronic packaging, connectors, headers and substrate solutions that utilize custom metal working capabilities as well an expertise in Glass-to-Metal Sealing (GTMS), Ceramic to Metal Sealing (CTMS), and High-Temperature of Cofired Ceramic(HTCC). Leading provider of microelectronic packaging, connectors and substrates since 1955 150,000 sq.ft. Of combined manufacturing space in the U.S. and Malaysia Multiple factory locations allowing for flexibility in manufacturing and security of supply Front end design engineering support Full tool room and machine shop High and low temperature brazing Precious metal plating operation High-Temperature Co fired Ceramic expertise GTMS and CTMS technology Testing to MIL-STD 883 ISO 9001 registered AS9100 registered RoHS compliant |
HCC Part Numbering Picture File.pdf